Designed for the entire electronics manufacturing process—including SMT assembly, PCB inspection, semiconductor packaging, and electronic component quality control—this solution provides comprehensive X-ray inspection throughout production.
Covering a wide range of industrial inspection scenarios—including casting inspection, weld examination, battery inspection, composite material evaluation, and non-destructive testing (NDT)—this solution delivers reliable internal quality assessment without damaging the inspected object.
Designed for food production and packaging lines, this solution provides comprehensive inspection for foreign object detection, product integrity verification, fill level inspection, missing component detection, and packaging quality control.
