The Online 3D AXI Intelligent Inspection System is an inline 3D X-ray inspection system designed for the automatic inspection of solder joint defects on printed circuit boards (PCBs) based on pre-programmed inspection criteria. It is particularly suitable for inspecting hidden solder joints, including BGA, LGA, QFN, QFP, and PTH through-hole components. The system is capable of detecting a wide range of soldering defects, including voids, insufficient solder (open solder joints), short circuits, foreign objects, component misalignment, and poor solder wetting.
The system is equipped with the Hikvision Guanlan Large AI Models, which delivers clearer X-ray images and more accurate inspection results while continuously improving its inspection performance through ongoing optimization.
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Ultra-fast fly-scan in 1.5 seconds with high-precision 3D imaging
Visual programming, offline parameter tuning, and 3D defect annotation for a more intuitive user experience
Integrated with Hikvision's Guanlan large AI model for enhanced image clarity, simplified parameter adjustment, and more accurate inspection
| Environmental Requirements | |
|---|---|
| Operating Temperature | 0℃~ 40℃ |
| Operating Humidity | 30%-70% |
| Power Supply | AC220V，50/60Hz |
| Total Power Consumption | ≤5.5kw |
| Air Pressure Requirement | 0.5-0.6MPa |
| Equipment Dimensions | |
| Dimensions | 1700*2170*1800（mm） |
| Weight | 3800kg |
An Automated X-ray Inspection (AXI) system captures X-ray images of electronic products and analyzes their internal structure without damaging the product. Powered by Hikvision Guanlan Large-Scale AI Models, the system automatically compares inspection images with trained AI models to detect defects, missing components, and assembly issues, helping improve inspection accuracy and production efficiency.
